Effects of Annealing Pressure of Nucleation Layer on High-Resistivity GaN

Jian Xu,Bo Shen,Fujun Xu,Zhenlin Miao,Maojun Wang,Sen Huang,Lin Lu,Yaobo Pan,Zhijian Yang,Guoyi Zhang
DOI: https://doi.org/10.3321/j.issn:0253-4177.2007.z1.029
2007-01-01
Abstract:The influence of the annealing pressure of the nucleation layer on the resistivity of GaN films grown in metal-organic chemical vapor deposition is investigated. It is found that the sheet resistance of GaN increases over seven orders of magnitude with decreasing the annealing pressure. Under the annealing pressure of 75 torr, GaN with sheet resistance higher than 1011 Ω/□ is achieved. X-ray diffraction measurements demonstrate that the density of the edge-type dislocations increases significantly in comparison with that of screw-type dislocations with decreasing the annealing pressure in GaN. It is suggested that the high-resistance GaN is achieved due to the deep acceptor levels introduced by the edge-type dislocations.
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