Effect of Substrate Temperature on the Growth and Properties of Boron-Doped Micro Crystalline Silicon Films

QS Lei,ZM Wu,XH Geng,Y Zhao,J Sun,JP Xi
DOI: https://doi.org/10.1088/1009-1963/15/1/035
2006-01-01
Abstract:Highly conductive boron-doped hydrogenated microcrystalline silicon (tic-Si:H) films are prepared by very high frequency plasma enhanced chemical vapour deposition (VHF PECVD) at the substrate temperatures (T-S) ranging from 90 degrees C to 270 degrees C. The effects of T-S on the growth and properties of the films are investigated. Results indicate that the growth rate, the electrical (dark conductivity, carrier concentration and Hall mobility) and structural (crystallinity and grain size) properties are all strongly dependent on T-S. As T-S increases, it is observed that 1) the growth rate initially increases and then arrives at a maximum value of 13.3 nm/min at T-S = 210 degrees C, 2) the crystalline volume fraction (X-c) and the grain size increase initially, then reach their maximum values at T-S = 140 degrees C, and finally decrease, 3) the dark conductivity (sigma(d)), carrier concentration and Hall mobility have a similar dependence on T-S and arrive at their maximum values at T-S = 190 degrees C. In addition, it is also observed that at a lower substrate temperature T-S, a higher dopant concentration is required in order to obtain a maximum sigma(d).
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