Aluminum doped silicon carbide thin films prepared by hot-wire CVD: Influence of the substrate temperature on material properties

Tao Chen,Deren Yang,Reinhard Carius,Friedhelm Finger
DOI: https://doi.org/10.1016/j.tsf.2011.01.298
IF: 2.1
2011-01-01
Thin Solid Films
Abstract:Successful p-type doping of μc-SiC:H with Al introduced from trimethylaluminum has been already demonstrated. In this work we focus on the influence of substrate temperature (TS=300–390°C) on the Al-doping. As TS is reduced from 390°C to 300°C, the crystallinity decreases from 75% to 55% and the dark conductivity σD decreases first by about three orders of magnitude before increasing again at TS=300°C. Both microstructure, as determined from Raman spectroscopy, and optical absorption are little affected by the change in TS. Upon annealing at 450°C in vacuum, σD increases typically by two orders of magnitude up to 10−4S/cm, which is explained by dopant activation as a result of hydrogen desorption. It is concluded that a process temperature >350°C is needed to obtain effective Al-doping for p-type μc-SiC:H thin films.
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