Abstract:We report on the enhancement of the heat transfer of a commercial thermal compound after incorporation of certain carbon nanomaterials. Carbon nanotubes and carbon nanospheres, characterized by transmission electron microscopy, were diffused in a thermal epoxy compound following a precisely developed protocol based on sonication. The heat transmission of these fabricated thermal interface materials was tested using a setup designed to monitor heat dissipation and transmission to the cooling system under simulated operating conditions of standard electronic components. The data were recorded every 10 seconds by an in house built data acquisition system controlled by LabVIEW software. The effect of the amount of the carbon nanomaterials incorporated in the thermal interface compound was investigated, including reproducibility of the recorded results. The incorporation of the carbon nanomaterials showed an improvement in the thermal properties of the fabricated thermal interface materials. The highest achieved heat transfer has been measured for thermal interface materials fabricated with 1% of carbon nanomaterials corresponding to a maximum temperature drop of 2 °C. In addition, the thermal resistance of the thermal interface material used was characterized by the steady state approach. The measurements revealed lowest thermal resistance values of 80.14 and 100.9 mm 2 K/W corresponding to the thermal interface materials containing 1% of carbon nanotubes and carbon nanospheres respectively. The aim was to incorporate the new developed thermal interface materials in the low voltage power supply electronics as part of the upgrade of the ATLAS detector at CERN, and to be integrated in electronic devices in general in order to protect the important electronic components from damage and overheating and thus expand their life span.

Effects of Surface Metal Layer on the Thermal Contact Resistance of Carbon Nanotube Arrays

Low Interfacial Thermal Resistance Between Crossed Ultra-Thin Carbon Nanothreads

Effect of Contact Pressure on the Performance of Carbon Nanotube Arrays Thermal Interface Material

Thermal Properties of Carbon Nanotube Array Used for Integrated Circuit Cooling

The Carbon Nanotube Based Nanocomposite with Enhanced Thermal Conductivity

Thermal Transport in One-Dimensional Van Der Waals Heterostructures: Effects of Coating Layers on the Thermal Conductivity of Carbon Nanotubes

Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials

Thermal resistance of thermal conductive adhesive anchored carbon nanotubes interface material

Heat Conduction Enhancement of a Thermal Interface Material for Heat Sink Applications Using Carbon Nanomaterials

Thermal Management for Purification of Aligned Arrays of Single-Walled Carbon Nanotubes Based on Thermocapillary Flow by Pulsed Heating

Thermal Conductivity Reduction in Carbon Nanotube by Fullerene Encapsulation: A Molecular Dynamics Study

Characterize the Thermal Properties of the Vertical Aligned Carbon Nanotubes Array Used for IC Cooling with Photothermal Method

Efficient natural-convective heat transfer properties of carbon nanotube sheets and their roles on the thermal dissipation.

Laser-induced Nanoscale Thermocapillary Flow for Purification of Aligned Arrays of Single-Walled Carbon Nanotubes.

Thermal Performance of Vertically-Aligned Multi-Walled Carbon Nanotube Array Grown on Platinum Film

Contact Resistance Effects in Carbon Nanotube Thin Film Transistors

Thermal boundary resistances of carbon nanotubes in contact with metals and polymers.

Measurement of the intrinsic thermal conductivity of a multiwalled carbon nanotube and its contact thermal resistance with the substrate

Effect of Al2O3 coating thickness on the thermal stability of Cu–carbon nanotube hybrids

Interface Effect on Thermal Conductivity of Carbon Nanotube Composites

Thermal transport across the interface between a suspended single-walled carbon Nanotube and air