Abstract:Owing to the outstanding properties of thermal conduction, lightweight, and chemical durability, carbon nanotubes (CNTs) have revealed promising applications in thermal management materials. Meanwhile, the increasingly popular portable electronics and the rapid development of space technology need lighter weight, smaller size, and more effective thermal management devices. Here, a novel kind of heat dissipation devices based on the superaligned CNT films and underlying microchannels is proposed, and the heat dissipation properties are measured at the natural condition. Distinctive from previous studies, by combining the advantages of microchannels and CNTs, such a novel heat dissipation device enables superior natural convection heat transfer properties. Our findings prove that the novel CNT-based devices could show an 86.6% larger total natural heat dissipation properties than bare copper plate. Further calculations of the radiation and natural convection heat transfer properties demonstrate that the excellent passive cooling properties of these CNT-based devices are primarily caused by the reinforcement of the natural convection heat transfer properties. Furthermore, the heat dissipation mechanisms are briefly discussed, and we propose that the very high heat transfer coefficients and the porous structures of superaligned CNT films play critical roles in reinforcing the natural convection. The novel CNT-based heat dissipation devices also have advantages of energy-saving, free-noise, and without additional accessories. So we believe that the CNT-based heat dissipation devices would replace the traditional metal-finned heat dissipation devices and have promising applications in electronic devices, such as photovoltaic devices, portable electronic devices, and electronic displays.

Thermal Properties of Carbon Nanotube Array Used for Integrated Circuit Cooling

Characterize the Thermal Properties of the Vertical Aligned Carbon Nanotubes Array Used for IC Cooling with Photothermal Method

Electrothermal Characterization of Single-Walled Carbon Nanotube (SWCNT) Interconnect Arrays

Electrothermal Characterization of Carbon Nanotube Field Effect Transistors (Cntfets)

Thermal Conductivity Of Configurable Two-Dimensional Carbon Nanotube Architecture And Strain Modulation

Carbon Nanotube Vias: A Reality Check

Investigation on self-heating effect in carbon nanotube field-effect transistors

Carbon Nanotube Vias: Does Ballistic Electron–Phonon Transport Imply Improved Performance and Reliability?

Thermal resistance of thermal conductive adhesive anchored carbon nanotubes interface material

High-Quality Vertically Aligned Carbon Nanotubes for Applications as Thermal Interface Materials

Nanoscale Heat Transport of Vertically Aligned Carbon Nanotube Bundles for Thermal Management Applications

Design and Test of Carbon Nanotube Biwick Structure for High-Heat-Flux Phase Change Heat Transfer

Advances of CNT-based Systems in Thermal Management

Quantitative Thermal Imaging of Single-Walled Carbon Nanotube Devices by Scanning Joule Expansion Microscopy.

Thermal Management for Purification of Aligned Arrays of Single-Walled Carbon Nanotubes Based on Thermocapillary Flow by Pulsed Heating

Effect of Contact Pressure on the Performance of Carbon Nanotube Arrays Thermal Interface Material

Enhancement of Natural Convection by Carbon Nanotube Films Covered Microchannel-Surface for Passive Electronic Cooling Devices.

Thermal boundary resistances of carbon nanotubes in contact with metals and polymers.

Efficient natural-convective heat transfer properties of carbon nanotube sheets and their roles on the thermal dissipation.

Thermal dissipation media for high power electronic devices using a carbon nanotube-based composite

Raman measurement of heat transfer in suspended individual carbon nanotube