Abstract:This paper investigates the electron and phonon transport and their implications for performance and reliability of single-walled carbon nanotube (SWCNT), double-walled carbon nanotube (DWCNT), and multiwalled carbon nanotube (MWCNT) vias-possibly the most imminent application of carbon nanotube (CNT)-based components in very large scale integration chips. Accurate resistance and thermal conductance models are provided for isolated CNTs, as well as bundles of these, based on detailed electrical and thermal transport physics in the submicrometer regime. It is found that although CNT vias are both electrically and thermally in the ballistic regime, their electrical and thermal performance still cannot match that of Cu via. While the large resistance of CNT vias may not be a significant concern for local interconnects, the resistance must be minimized to avoid degradation of global interconnect performance. Furthermore, detailed 3-D electrothermal simulations indicate that Joule heating and thermal contact resistance between CNTs and metal can be a major bottleneck in extracting the maximum thermal performance from ballistic CNT bundle vias. From a processing perspective, we show that the applicability of MWCNT vias, which are currently being fabricated, is severely limited by their large thermal and electrical resistance. For SWCNT- and DWCNT-based vias, small-diameter CNTs with dense packing as well as good thermal and electrical contact between CNT and metal are needed.

Electrothermal Characterization of Single-Walled Carbon Nanotube (SWCNT) Interconnect Arrays

Electrothermal Characterization of Carbon Nanotube Field Effect Transistors (Cntfets)

Modeling of carbon nanotube (CNT) interconnects

Investigation on self-heating effect in carbon nanotube field-effect transistors

Temperature Effects on Crosstalk in Carbon Nanotube Interconnects

Electrothermal investigation on through silicon multi-walled carbon nanotube via interconnects

Electrothermal Cosimulation of 3-D Carbon-Based Heterogeneous Interconnects

Carbon Nanotube Vias: Does Ballistic Electron–Phonon Transport Imply Improved Performance and Reliability?

Electromagnetic Compatibility-Oriented Study on Through Silicon Single-Walled Carbon Nanotube Bundle Via (TS-SWCNTBV) Arrays

Carbon Nanotube Vias: A Reality Check

Carbon‐Based Interconnects for RF Nanoelectronics

High-Frequency Analysis of Cu-Carbon Nanotube Composite Through-Silicon Vias

Circuit Modeling and Performance Analysis of Multi-Walled Carbon Nanotube Interconnects

Electrothermal modelling of novel through-silicon carbon nanotube bundle vias (TS-CNTBV)

Transient electro-thermal analysis of single-walled carbon nanotube (SWCNT) with transmission line model

Quantitative Thermal Imaging of Single-Walled Carbon Nanotube Devices by Scanning Joule Expansion Microscopy.

Thermal Management for Purification of Aligned Arrays of Single-Walled Carbon Nanotubes Based on Thermocapillary Flow by Pulsed Heating

Electrothermal Investigation on Vertically Aligned Single-Walled Carbon Nanotube Contacted Phase-Change Memory Array for 3-D ICs

Frequency-Thermal Characterization Of On-Chip Single-Walled Carbon Nanotube Interconnects

Reliability Evaluation of Carbon Nanotube Interconnect in a Silicon CMOS Environment

Modelling of self-heating effects in multi-wall carbon nanotube interconnects