Abstract:Complex silicon carbide (SiC) ceramic components are difficult to fabricate due to their strong covalent bonds. Binder jetting (BJ) additive manufacturing has the outstanding advantages of high forming efficiency and no thermal deformation, especially suitable for printing complex structure SiC components. This study tried to obtain low silicon content silicon carbide ceramics by binder jetting followed by phenolic resin impregnation and pyrolysis (PRIP) and liquid silicon infiltration (LSI). BJ was used for the SiC green parts fabrication, and the highest compressive strength (7.7 ± 0.3 MPa) and lowest dimensional deviations (1.2–1.6 mm) were obtained with the printing layer thickness of 0.15 mm. Subsequently, PRIP treatments were introduced to increase the carbon content for the following LSI process. As the number of PRIP cycles increased, the carbon density of SiC/C preform increased and the porosity decreased. After the LSI treatment, the final Si-SiC composites processed with 2 PIRP cycles reached the highest flexural strength (257 ± 14.26 MPa) and the best wear resistance. This was attributed to the low residual silicon content (10.2 vol%) and almost no residual carbon. Furthermore, several complex structural components were fabricated using these methods. The preparation of complex components verifies the feasibility of BJ and LSI for manufacturing high-strength and high-precision SiC ceramics. Besides, this work hopes to provide technical guidance for the preparation of complex SiC composites in the future.

Fabrication of Si3N4 micro-components by a combined microfabrication process

Fabrication of Si<sub>3</sub>N<sub>4</sub> Micro-Components by a Combined Microfabrication Process

Fabrication of Reaction-Sintered SisN_4 Ceramic Microrotors

Manufacturing Miniature Si-Based Ceramic Rotors by Micro Reaction Sintering

Optimization of Microstructure to Improve Si3n4 Ceramics with Thermal Conductivity and Mechanical Properties: Effect of Si and Α-Si3n4 Powder Composition

Silicon Carbide Micro-Reaction-Sintering Using Micromachined Silicon Molds

Manufacturing Silicon Carbide Microrotors by Reactive Hot Isostatic Pressing within Micromachined Silicon Molds

Microfabrication Technology of Three-Dimensional Microdevices and Their Mems Applications

Si 3 N 4 ceramics with embedded microchannel structures fabricated by high-precision additive manufacturing based on computational fluid dynamics simulations

Fabrication of SiCN MEMS by UV Lithography of Polysilazane

Microfabrication of thermoelectric materials by silicon molding process

POLYMER-DERIVED SIC CERAMIC WITH TRIPLY PERIOD MINIMAL SURFACE STRUCTURE FABRICATION THROUGH DIGITAL LIGHT PROCESSING

One-pot microfluidic fabrication of micro ceramic particles

Fabrication Methods for Microscale 3D Structures on Silicon Carbide

Fabricating Processes of Free-Standing Silicon Nitride Thin Film for MEMS Devices

Processing and properties of nanophase SiC/Si3N4 composites

Development of Thermoelectric Microdevices by Combining Materials Processing and Silicon Micromachining Technology

Fabrication of Si3n4/Sic Nanocomposites by Spark Plasma Sintering of Amorphous Sicn Powders Derived from A Polymeric Precursor

Fabrication of Si 3 N 4 ceramics with high thermal conductivity and flexural strength via novel two-step gas-pressure sintering

Preparation of low residual silicon content Si-SiC ceramics by binder jetting additive manufacturing and liquid silicon infiltration