Abstract:Silicon carbide (SiC) microchannels are attractive for their wide applications in microsensors, MOS devices, UV photodiodes, microcatalytic reactors, and microchannel heat exchangers in harsh environments. However, the machining of SiC microchannels poses many challenges because of the difficulty and cost involved in the material removal process due to the high hardness and brittleness of SiC ceramic. In the present study, we developed a thin diamond wheel grinding process to fabricate SiC microchannels in a conventional vertical milling machine. Microchannels with trapezoidal shapes were successfully processed in SiC substrates by thin diamond wheels. The formation, geometric dimensions, and surface quality of SiC microchannels were studied together with the analysis of material removal mechanism. The effects of grinding processing parameters, i.e., wheel speed, feed speed, grinding depth, and grinding tool parameters including grit size and thickness of diamond grinding wheel, on the geometric dimension and surface morphology were comprehensively explored. The top width of microchannels first increased and then decreased with the increase in wheel speed, whereas a reverse tendency was observed with increasing grinding depth, feed speed, and grit size. The surface roughness decreased continuously with increasing wheel speed, but it tended to increase with the increase in feed speed generally. The variations in geometric dimensions and surface roughness of SiC microchannels can be related to the crack or fracture propagations and material removal mechanism during the thin diamond wheel grinding process. Besides, the influential significance of the above processing and grinding tool parameters were also evaluated by analysis of variance (ANOVA).

Fabrication Methods for Microscale 3D Structures on Silicon Carbide

Producing Silicon Carbide Micro and Nanostructures by Plasma‐Free Metal‐Assisted Chemical Etching

One-dimensional SiC Nanostructures: Designed Growth, Properties, and Applications

Electrochemical etching strategy for shaping monolithic 3D structures from 4H-SiC wafers

Fabrication of Si3N4 micro-components by a combined microfabrication process

Fabrication of Si<sub>3</sub>N<sub>4</sub> Micro-Components by a Combined Microfabrication Process

Silicon carbide for microelectromechanical systems

Fabricating 3D Si nanostructure via a novel Ga+ implantation enabled maskless dry etching process

Method for preparing silicon carbide micro-structures

Controllable reduction of absorbance and two-step reaction for 3D-printed SiC ceramics with micron-level periodic structure

Geometrically Complex Silicon Carbide Structures Fabricated by Robocasting

Status of Silicon Carbide Micromachining, Circuits and Sensing Devices

3D printing of high‐purity silicon carbide

One-step Ion Beam Irradiation Manufacture of 3D Micro/nanopatterned Structures in SiC with Tunable Work Functions

Silicon Carbide Micro-Reaction-Sintering Using Micromachined Silicon Molds

Fabrication of silicon carbide microchannels by thin diamond wheel grinding

Simple Method for Fabrication of Microchannels in Silicon Carbide

A Review of Femtosecond Laser Processing of Silicon Carbide

3D-feature-based structure design for silicon fabrication of micro devices

Low-Dimensional Sic Nanostructures: Fabrication, Luminescence, and Electrical Properties

Fabrication of high aspect ratio, non-line-of-sight vias in silicon carbide by a two-photon absorption method