Abstract:In advanced technology nodes, large timing margins must be added to allow for worse process, voltage, temperature, and aging variations. The error detection and correction (EDAC) technique effectively eliminates these margins by timing speculation, but the high design complexity and large hardware cost make many existing EDAC systems unsuitable for commercial processors. Based on the instruction-level locality of timing errors, a collaborative EDAC approach is proposed to address this issue. The hardware layer adopts simple and low cost EDAC circuits to ensure correct operation when timing error occurs, while a runtime software layer prevents recurring errors of the same instruction by sending timing error alarms to the hardware layer. Cooperation of both layers, accompanied with the proposed profile-guided timing error avoidance algorithm, eliminates more than 95% of errors with small runtime overhead. This significantly improves overall performance and alleviates pressure on the EDAC circuits. Experimental results based on the three-stage commercial CK802 processor in SMIC 40LL process present that the approach has improved the peak performance of the baseline EDAC system (Razor-Lite + half-frequency replay) by 8% and reduced the energy consumption by 25%, with less than 1.4% area overhead.

A New Self-Test Structure for At-Speed Test of Crosstalk in SoC Busses

A Test Architecture for Test Reuse in SOC Design

An improved method for test chip design

Self-test methodology and structures for pre-bond TSV testing in 3D-IC system

Software- Based Self-Testing Methodology for Embedded Processor Cores

An Improved Test Access Mechanism Structure and Optimization Technique in System-on-chip

A Fully Automated Large-Scale Addressable Test Chip Design with High Reliability

Pipelined Parallel Test Structure for Mixed-Signal SoCs.

Testing Structure for Detection of Poly Stringer Defects in CMOS ICs

A novel layout automation flow to facilitate test chip design for standard cell characterization

Eliminating Timing Errors Through Collaborative Design to Maximize the Throughput

Design for HW/SW Co-Testing Based on FPGA

Research on Test Structure of Analog Cores in Mixed-Signal SoCs

Test Pattern Generation for Crosstalk-Induced Delay Faults Based on MAF Model

Advanced Low Pin Count Test Architecture for Efficient Multi-Site Testing

A Shielding Structure for Crosstalk Reduction in Silicon Interposer

Design of Mixed-Signal Circuit for Testability

Conflict Driven Scan Chain Configuration for High Transition Fault Coverage and Low Test Power

Accelerating Strategy for Functional Test of NoC Communication Fabric

A Novel Test Application Scheme for High Transition Fault Coverage and Low Test Cost

A Microprocessor Based SOC Built-In Test Scheme