Abstract:enough. However, the complications associated with IP from different sources, having incompatible test strategies and requiring several types of testers, make a difficult situation nearly impossible. The answer is to build at least some of the test hardware on-chip. Ideally, a DFT technology should scale to larger devices so that common test approaches can be used across several designs. Test hardware can be straightforward IEEE 1149.1 scan logic or complex and application-specific, built-in self-test (BIST) circuitry. When the DUT is placed in a special test mode, scan logic reconfigures a device's latches into serial shift registers. Predetermined test vectors then can be shifted into the DUT, a test executed, and the test results shifted out for analysis. BIST may use the same 1149.1 test access port (TAP) pins for control, but vector generation and analysis are provided on-chip by the BIST test circuitry. Different BIST schemes are appropriate for logic, memory, and some special functions such as analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) and phase-locked loops (PLLs). A New design tools make it easy to include the right level of DFT with minimal overhead. Courtesy of Teradyne ntil recently, design for testability (DFT) had almost perfectly exemplified the conjunction of incongruous or contradictory terms: it was an oxymoron. Semiconductor companies acknowledged that they ranked DFT with unsettling concepts such as qualified success and deafening silence, but designing in testability always had been difficult. Consequently, manufacturers often solved the problem of reconciling design and test by avoiding it. The fact that the situation has changed is as remarkable as the cause. For many years, larger and faster ICs required larger and faster and more expensive ATE. The growth of the system on a chip (SOC) business has leapfrogged any possibility of continuing to follow this established test paradigm. Instead of IC size simply increasing each year by perhaps a million gates and a few more pins, SOCs today may integrate as many as 30 to 60 different intellectual property (IP) cores on a single chip. And, SOCs ignore the traditional segregation of memory, logic, and analog functions. Being faced with the need to test the very large chips that result from such an IP combination is bad

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A Test Architecture for Test Reuse in SOC Design

A System Verification Environment for Mixed-Signal SOC Design Based on IP Bus

Challenges for Progress in Test and Design for Testability

Introduction to the Special Issue on Design for Testability and Reliability of Security-aware Hardware

An improved method for test chip design

Non-scan design for testability for mixed RTL circuits with both data paths and controller via conflict analysis

Analog/digital ASIC design for testability

Non-Scan Design For Testability For Synchronous Sequential Circuits Based On Fault-Oriented Conflict Analysis

Non-Scan Design For Testability Based On Fault Oriented Conflict Analysis

Design for HW/SW Co-Testing Based on FPGA

Non-Scan Design for Testability for Synchronous Sequential Circuits Based on Conflict Analysis

Pipelined Parallel Test Structure for Mixed-Signal SoCs.

Nonscan Design for Testability for Synchronous Sequential Circuits Based on Conflict Resolution

A Fully Automated Large-Scale Addressable Test Chip Design with High Reliability

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Efficient Circuit Structure Analysis for Automatic Behavioral Model Generation in Mixed-Signal System Simulation

Design of the Addressable Test Structure for ${S}$ -Parameter-based RF Device Characterization

Advanced Low Pin Count Test Architecture for Efficient Multi-Site Testing

Combined Self-Test of Analog Portion and ADCs in Integrated Mixed-Signal Circuits

Self-test methodology and structures for pre-bond TSV testing in 3D-IC system