Abstract:enough. However, the complications associated with IP from different sources, having incompatible test strategies and requiring several types of testers, make a difficult situation nearly impossible. The answer is to build at least some of the test hardware on-chip. Ideally, a DFT technology should scale to larger devices so that common test approaches can be used across several designs. Test hardware can be straightforward IEEE 1149.1 scan logic or complex and application-specific, built-in self-test (BIST) circuitry. When the DUT is placed in a special test mode, scan logic reconfigures a device's latches into serial shift registers. Predetermined test vectors then can be shifted into the DUT, a test executed, and the test results shifted out for analysis. BIST may use the same 1149.1 test access port (TAP) pins for control, but vector generation and analysis are provided on-chip by the BIST test circuitry. Different BIST schemes are appropriate for logic, memory, and some special functions such as analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) and phase-locked loops (PLLs). A New design tools make it easy to include the right level of DFT with minimal overhead. Courtesy of Teradyne ntil recently, design for testability (DFT) had almost perfectly exemplified the conjunction of incongruous or contradictory terms: it was an oxymoron. Semiconductor companies acknowledged that they ranked DFT with unsettling concepts such as qualified success and deafening silence, but designing in testability always had been difficult. Consequently, manufacturers often solved the problem of reconciling design and test by avoiding it. The fact that the situation has changed is as remarkable as the cause. For many years, larger and faster ICs required larger and faster and more expensive ATE. The growth of the system on a chip (SOC) business has leapfrogged any possibility of continuing to follow this established test paradigm. Instead of IC size simply increasing each year by perhaps a million gates and a few more pins, SOCs today may integrate as many as 30 to 60 different intellectual property (IP) cores on a single chip. And, SOCs ignore the traditional segregation of memory, logic, and analog functions. Being faced with the need to test the very large chips that result from such an IP combination is bad

Analog/digital ASIC design for testability

A Design for Testability Approach for Nano-Cmos Analogue Integrated Circuits

Design of Mixed-Signal Circuit for Testability

Design for Testability of a Resilient Packet Ring ASIC

Design for Testability in Nano-Cmos Analog Integrated Circuits Using a New Design Analog Checker

Design for Testability Design Test Test Development Failure Diagnosis the Multiple Facets of Dft Figure 1. Closing the Dft Gap

FATE: A Flexible FPGA-Based Automatic Test Equipment for Digital ICs

Design and Implementation of DFT Strategy in ASIC Design of Resilient Packet Ring

A Self-Test and Self-Repair Approach for Analog Integrated Circuits

A Case Study of Testing Strategy for AI SoC

Extraction and optimization of analog circuit built-in self test fault features

Design for Testability for System-on-Chip

Combined Self-Test of Analog Portion and ADCs in Integrated Mixed-Signal Circuits

An improved method for test chip design

Testing and fault detecting of analog integrated circuit

A Fully Automated Large-Scale Addressable Test Chip Design with High Reliability

A novel research on mixed-signal SoC self-hold analog IP core test wrapper design

Addressable Test-Chip Compiler for Test Chip Design Automation and Transistor/yield Characterization

FPGA based low-cost Portable Tester with On-Board Supplies

Analogous Alignments: Digital "Formally" meets Analog

Research on Test Structure of Analog Cores in Mixed-Signal SoCs