Abstract:Many SOCs today contain both digital and analog embedded cores. Even though the test cost for such mixed-signal SOCs is significantly higher than that for digital SOCs, most prior research in this area has focused exclusively on digital cores. We propose a low-cost test development methodology for mixed-signal SOCs that allows the analog and digital cores to be tested in a unified manner, thereby minimizing the overall test cost. The analog cores in the SOC are wrapped such that they can be accessed using a digital test access mechanism (TAM). We evaluate the impact of the use of analog test wrappers on area overhead and test time. To reduce area overhead, we present an analog test wrapper optimization technique, which is then combined with TAM optimization in a cost-oriented heuristic approach for test scheduling. We also demonstrate the feasibility of using analog wrappers by presenting transistor-level simulations for an analog wrapper and a representative core. We present experimental results on test scheduling for an ITC'02 benchmark SOC that has been augmented with five analog cores.

Research on Test Structure of Analog Cores in Mixed-Signal SoCs

A novel research on mixed-signal SoC self-hold analog IP core test wrapper design

Pipelined Parallel Test Structure for Mixed-Signal SoCs.

Optimization of Self-Hold Interface for Analog Cores by Virtual Digitization

Test Planning for Mixed-Signal SOCs with Wrapped Analog Cores

A Test Architecture for Test Reuse in SOC Design

Joint testing scheme on mixed SoC

An improved method for test chip design

Software- Based Self-Testing Methodology for Embedded Processor Cores

Dual-Speed TAM Optimization of 3D SoCs for Mid-bond and Post-bond Testing

Concurrent Core Test for SOC Using Shared Test Set and Scan Chain Disable

A Case Study of Testing Strategy for AI SoC

Performance Parameter Testing for ADC and DAC IP Cores Without I/O Multiplexing in SoC Using Verigy 93000

A Fully Automated Large-Scale Addressable Test Chip Design with High Reliability

Low Power Pipelined A/D Converter in 0.6 Μm Technology

A Microprocessor Based SOC Built-In Test Scheme

An Improved Test Access Mechanism Structure and Optimization Technique in System-on-chip

Design for HW/SW Co-Testing Based on FPGA

Reconfigured Test Architecture Optimization For Tsv-Based Three-Dimensional Socs

Cost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test

Effective Design Method to Reduce SCAN Test Application Time of SOC's