Abstract:Accurate measurement of critical strain and stress of a thin film when it fractures is crucial during testing of fracture toughness. In microbridge testing method, tensile displacement of a film is in consistent with the crack opening distance (COD) of substrate pre-crack at position where it anchors. However, a mathematical model for COD is difficult to deduce in mechanics due to the complex mechanical condition cause by the non half infinite boundary and the existence of an arresting hole near crack tip. High resolution scanning electron microscope (HR-SEM) is used to examine the COD of substrate pre-crack. Both of the opening distance (delta(s1)) at crack end and the opening distance (delta(s2)) at the edge of arresting hole were accurately measured. Results show that delta(s1) and delta(s2) varies linearly when delta(s1) is in range of 9 similar to 35 mu m. A stationary virtual crack tip was then hypothesized so that a linear relationship of COD of substrate pre-crack was subjected. Film tensile displacement can then be easily determined according to delta(s1) and the position the film anchored. A mathematical mode for fracture toughness of a film was derived via superposition of uni-axial tensile stress and the pure bending stress the film endured during tensile testing. A test for CuZr amorphous thin film was carried out, and 1. 08 similar to 1. 70 MPa.m(1/2) of K-IC is obtained. Results reveal that test values of K-IC vary with the length of the pre-crack on film specimens (a/W) , which may be resulted from the stain softening of amorphous metallic glass.

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