Abstract:The residual stress plays a vital role in determination of the device performance that uses thin films coating and thus the accurate determination of stress and its optimization with process parameters is an ongoing research work for many decades. In line with this, the microscopic origin of the stress at the atomic scale and its development during the thin film deposition is a matter of major scientific interests. The development of stress is a complex phenomenon and has a complex dependence to process parameters, film microstructure and its morphology. In this work, by utilizing a custom-designed cathodic arc deposition system and synchrotron radiation based 2D x-ray diffraction (XRD) technique, we determine the real-time evolution of stress, crystallite sizes and their preferential orientations of Aluminum-Titanium-Nitride (AlxTi1-xN) films with varied Al-content (x=0.0, 0.25, 0.50, and 0.67) on Si-100 substrate. The energies of incoming ions and hence stress in the films is tuned by applying different direct current substrate bias (Vs = floating potential, -20, -40, -60, -80, and -100 V). The instantaneous stress is evaluated by the well-known d vs. sin2{\psi} technique, while crystallite sizes are determined by analyzing line profiles of x-ray diffractograms. The evolution of stress and crystallite sizes are modelled with multiple numerical models from which kinetic parameters associated with the thin film depositions are extracted. The ex-situ microstructure characterizations of AlxTi1-xN coatings are carried out by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The formation of ex-situ microstructure of the films is discussed considering the results obtained from in-situ XRD data. Finally, we demonstrate that the method utilized here is a powerful approach towards estimation of the fracture toughness of thin film coatings.

Determination of the fracture strength for ceramic film on substrate by X-ray stress analysis method

Yield Strength Determination of TiN Film by In-Situ XRD Stress Analysis Method

Study on the Mechanism and Measurement of Stress of Tio2 and Sio2 Thin-Films

Externally Applied Stress Sign and Film Elastic Properties Effects on Brittle Film Fracture

An Inverse Problem in Estimating Fracture Toughness of TiAlN Thin Films by Finite Element Method Based on Nanoindentation Morphology

Investigation of the characteristics of TiN-coating film deposited by arc ion plating method and the feasibility of measuring residual stress according to heat treatment

Characteristics Of Residual Stresses In Ti-N Films Coated By Plasma Enhanced Chemical Vapor Deposition

Test Method for Residual Stress Analysis of the Inner Surface of Small Caliber Ti-3Al-2.5V Tubing by X-ray Diffraction

In-situ real-time evolution of intrinsic stresses and microstructure during growth of cathodic arc deposited (Al,Ti)N coatings

Microstructure, residual stress, and fracture of sputtered TiN films

Evaluation of Crack-Tip Stress in Titanium Oxide Film Using Piezo-Spectroscopy Methods

Preparation of Ti and TiN Films and Investigation of the Residual Stress Measuring Method

A Method of the X-ray Diffraction of Substrate for Measuring Films Thickness

Film thickness effect on texture and residual stress sign transition in sputtered TiN thin films

The Mechanical Behaviour of Tin and Multi-Layered Coating of Tin/Ti on Ti6al4v Substrate During Nano-Indentation

Measuring Interface Fracture Resistance in Thin Hard Films

Experimental and Numerical Evaluations of Adhesion Strength and Stress in Tin Films Deposited on Ti-Implanted Aluminum

A Method for Biaxial Fracture Stress Test of Nanoscale Film

Experimental Tests and Numerical Simulation Studies on Nano-Indentation of Tin Film Deposited on N+-Implanted Aluminum

Discontinuous Cracking of TiN Films on a Steel Substrate Induced by an Adhesive Interlayer

The estimation of residual stresses by the brittle thin film’s initial cracks on a ductile substrate subjected to tensile stresses