Abstract:Interfacial bonding integrity between different materials is critical to maintain the functionality of the entire physical system in any scale, ranging from building structures down to semiconductor transistors. For example, micro-patterned polymers embedded with conductive nanoparticles [e.g., carbon nanotubes (CNTs)] bonded with integrated circuits have been applied as many emerging chemical/biological microelectronic sensors. Nonetheless, it is challenging to measure and ensure the interfacial bonding integrity between materials for consistent and sustainable operations. Herein, we apply multiple interface characterization methods based on micro-engineering and microscopy as an integrative approach to reveal the mechanism of interfacial reinforcement by adding CNTs in a matrix material. An epoxy/CNT micro-beam is fabricated onto a silicon substrate, sandwiching a gold layer as an interfacial precrack. Superlayers of chromium are then repeatedly deposited onto the microstructure, inducing stepwise increasing stress over the materials and the corresponding micro-beam bending after detachment from the bonded interface. Accordingly, we can quantify key interfacial fracture parameters such as crack length, steady-state energy release rate, and fracture toughness. By further examining the formation and distribution of the micro-/nanostructures along the debonded interface using bright-field microscopy, 3D fluorescence imaging, and scanning electron microscopy, we can identify the underlying dominant interfacial strengthening and fracture toughening mechanisms. We further compare experimental results and theoretical predictions to quantify the interfacial bonding properties between epoxy/CNT and silicon and unveil the underlying reinforcement mechanisms. The results provide insights to develop polymer/nanoparticle composites with reinforced interfacial bonding integrity for more sustainable and reliable applications including microelectronics, surface coatings, and adhesive materials.

Adhesion and debonding of multi-layer thin film structures

Micromechanics-Based Modeling of Interfacial Debonding in Multilayer Structures

A robust nanoscale experimental quantification of fracture energy in a bilayer material system

Adhesion strength of ductile thin film determined by cross-sectional nanoindentation

Plasticity contributions to interface adhesion in thin-film interconnect structures

Decohesion of graphene from a uniaxially-stretched substrate: Failure analysis of a frictional adhesive interface

Residual Stresses And Debonding Of Diamond Films On Titanium Alloy Substrates

Adhesion measurement of thin films by a modified laser spallation technique: theoretical analysis and experimental investigation

Decohesion of a rigid flat punch from an elastic layer of finite thickness

Interfacial debonding in a thin plate bonded to a rigid substrate with a circular hole

Micro-Scale Delaminating and Buckling of Thin Film on Soft Substrate

A four-point bending technique for characterizing the interface fracture toughness between soft thin films and stiff substrates

Buckle-driven Delamination of Thin Film and the Influence of the Casimir or Van Der Waals Force Interaction

Fatigue-Resistant Adhesion Through High Energy Barriers

Influence of debonding and substrate plasticity on thin film multicracking

Adhesion Strengthening Mechanism of Carbon Nanotube-Embedded Epoxy Composites: A Fracture-Based Approach

Thickness Mediated Morphology Evolution in Sub-10-nm Metal Film Deposition: Implications for Nondestructive Testing

Fracture Behavior of Alumina/Epoxy Resin Interface and Effect of Water Molecules by Using Molecular Dynamics Using Reaction Force Field (ReaxFF)

On debonding of thin films

Debonding mechanisms in the presence of an interphase in composites

Size-Dependent Thermomechanical Responses of Nano-Sized Multilayers