Photoacoustic Characteristics of Dynamical Adhesion of Films on a Metallic Substrate

M. Zhou,Y.K. Zhang,L. Cai,J.Z. Zhou,Z.H. Shen,X.R. Zhang,S.Y. Zhang
DOI: https://doi.org/10.1007/s00339-002-1665-4
2003-01-01
Applied Physics A
Abstract:In this communication, we report a numerical model that predicts the mechanical deformations associated with the pulsed laser irradiation of a film surface, based on thermal diffusion theory. The model is consequently advanced to produce a method for evaluating film adhesion strength. The epicenter surface displacements within the irradiated fields have been measured using a heterodyne interferometer. The comparison of the experimental data and the displacements calculated by the model shows good agreement. By investigating the propagating acoustic modes under non-destructive and destructive modes, we reveal that, with or without interface delamination, the phase structure of the longitudinal waves will be altered due to the change of reflection mode at the interface. Applying shock dynamics theory, we evaluate the adhesion strength of the TiN/stainless interface. We also indicate the strain rate can be up to 105∼106 s-1 during film interface delamination.
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