Thin-Film Adhesion Measurement Using Laser-Generated High-Power Surface Acoustic Wave

V. Kireev,Y. Liu,Y. Braiman,B. Radhakrishnan,C. H. Hsueh,P. F. Becher
DOI: https://doi.org/10.1063/1.2203205
IF: 4
2006-01-01
Applied Physics Letters
Abstract:A method of the interfacial adhesion measurements utilizing the generation and monitoring of high-power surface acoustic wave has been reported. High-power surface acoustic wave was generated by surface optical breakdown in a transparent dielectric substrate. Modification of the tension-to-shear stresses ratio with film thickness was demonstrated. The normal stress generated at the interface is about one order of magnitude higher compared to those reported in laser spallation experiments; therefore stronger interfaces can be tested with less damage to the substrate.
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