Towards interface toughness measurement in nanometric films

Jean-Yvon Faou,G. Parry

2013-10-22

Abstract:Thin films deposited on substrates are usually submitted to large residual compression stresses, causing delamination and buckling of the film into various patterns. This phenomenon has been widely investigated in the past few decades, both experimentally and with nonlinear plates models. Nevertheless, the formation of the most commonly observed pattern, the “telephone cord blister”, has only be understood recently, with FEM models coupling post-buckling studies and mixed-mode adhesion. Here, relying on these models, we show remarkable properties of these wavy blisters, in particular we show that the wavelength of the telephone cord patterns scales linearly with a parameter depending on the stress level in the film, the thickness and the adhesion energy. This result has an important practical application. As a matter of fact, since it is experimentally possible to control the stress level and the film thickness during elaboration, the measurement of this wavelength can indirectly lead to a measurement of the interface toughness, even in very small films.

Engineering,Physics,Materials Science