Current status of blister tests for adhesion of thin films to substrate

Zhuang Yaomin
Abstract:The current status and the new progress of blister tests for measuring interfacial adhesion strength between film and substrate are reviewed in this article. The assuming precondition for the thin film's mechanics behavior, the argument means related to energy-balance and the deduction of the analytical mechanics models in blister test for the thin films with circular window and thin films with rectangular/square window, which have and have no residual stress, are analyzed especially. The micro-machining process fabricating free-standing thin film window on Si substrate is introduced. Stressed is the status of the mechanical model and fabrication technique of specimens used in the test, including their advantages and disadvantages, and some application samples of blister test are given. Moreover, the future work should be carried out in the establishment of the mechanical model in plastic deformation phase and the fabrication of non-silicon substrate specimen.
Engineering,Materials Science
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