Fabrication of Textured Ni–9.3at.%W Substrate by Electropulsing Intermediate Annealing Method

Jianan Liu,Wei Liu,Guoyi Tang,Rufei Zhu
DOI: https://doi.org/10.1016/j.physc.2013.12.001
2013-01-01
Physica C Superconductivity
Abstract:Sharp cube texture is difficult to obtain in high W content Ni–W alloy substrates used for coated conductors. In this paper, a new method called electropulsing intermediate annealing (EIA) is adopted to optimize the rolling and recrystallization texture of Ni–9.3at.%W substrate. It is found that, compared with conventional intermediate annealing (CIA) at the same temperature, EIA trends to increase the Copper, S and Brass components, suppress the Goss component in rolling texture. Higher cube recrystallization texture is obtained at relatively low temperature by EIA in a shorter time. The effect of EIA on texture is attributed to the enhancement of recovery process resulting from the athermal effects.
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