A Water‐free Low Temperature Process for Atomic Layer Deposition of Al2O3 Films

Jiao-Jiao Guo,Ming-Da Li,Qing-Qing Sun,Wen Yang,Peng Zhou,Shi-Jin Ding,David Wei Zhang
DOI: https://doi.org/10.1002/cvde.201207032
2013-01-01
Chemical Vapor Deposition
Abstract:A new low temperature atomic layer deposition (LT-ALD) Al2O3 process using trimethylaluminum (TMA) and acetic acid (CH3COOH) is studied both theoretically and experimentally. The atomistic mechanisms of the two deposition half-cycles on Al-CH3*, Al-OH*, and Al(2-O2CCH3)* are investigated using density functional theory (DFT). The experimental demonstrations are performed on Si substrates over the growth temperature range 75-400 degrees C. Consistent with the DFT simulation, lower linear growth rate and shorter required oxidant purge times are observed at 90 degrees C, when compared to LT-ALD Al2O3 using H2O as the oxidant. The chemical characteristics of the Al2O3 films grown with both CH3COOH at 90 degrees C and H2O at 100 degrees C are determined and compared using X-ray photoelectron spectroscopy (XPS).
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