H2O-based Atomic Layer Deposition Mechanism of Aluminum Oxide Using Trimethylaluminum

Yingying Wang,Jiayi Guo,Chenqi Bai,Lina Xu,Hongping Xiao,Qian Shi,Yihong Ding,Aidong Li,Guoyong Fang
DOI: https://doi.org/10.1016/j.susc.2024.122580
IF: 1.9
2024-01-01
Surface Science
Abstract:As a nanofabrication technology, atomic layer deposition (ALD) has been widely used in the fields of displays, microelectronics, nanotechnology, catalysis, energy and coatings. It demonstrates excellent conformality, large- area uniformity and precise control of the sub-monolayer film. Al2O3 2 O 3 ALD using trimethylaluminum (TMA) and water (H2O) 2 O) as precursors is the most ideal ALD model system. In this work, the reactions of TMA and H2O 2 O with the surface have been investigated using density functional theory (DFT) calculations in order to obtain more information on the reaction mechanism of the complicated H2O-based 2 O-based ALD of Al2O3. 2 O 3 . In the TMA reaction, the methyl ligands can be eliminated and new Al-O bonds can be formed via ligand exchange reactions. In the H2O 2 O reaction, the methyl ligand on the surface can be further eliminated and new Al-O - O bonds can be formed. Meanwhile, the coupling reactions between the surface methyl and hydroxyl groups can further form new Al-O - O bonds and release CH4 4 or H2O 2 O to densify the Al2O3 2 O 3 film. These complicated reaction mechanisms of Al2O3 2 O 3 H2O- 2 O- based ALD can provide theoretical guidance for the precursor design and ALD growth of other oxides and aluminum-based compounds.
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