Study on a-plane GaN etching residual stress using Raman scattering

Wang Dang-Hui,Hao Yue,Zhang Jin-Cheng,Xu Sheng-Rui,Bi Zhi-Wei,Zhao Sheng-Lei,Meng Fan-Na,Xue Xiao-Yong,Zhang Lin-Xia
2012-01-01
Abstract:In this study, we have studied the etching residual stress for a-plane GaN films grown on r-plane (1 (1) over bar 02) sapphire substrate with three different structures by low-pressure metal-organic vapor deposition (LPMOCVD). Scanning electron microscopy (SEM) and Raman scattering have been employed to study the surface morphology and residual stress before and after KOH solution etching. The three phonon modes of E-2 (high), A(1) (TO) and E-1 (TO) and surface etching morphology of a-plane GaN have been observed. We calculated the residual stress using the biaxial elastic stress theory. Conclusions show that E-2 (high) phonon shifts decrease after etching with KOH solution for a-plane GaN epilayer, which shows that KOH solution etching make the residual stress release. Based on the results, we indicated that there exists an approximate linear relation between residual stress etched by KOH solution and biaxial elastic stress system in a-plane GaN epilayers.
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