Boron and phosphorous diffusion in ion-beam-sputtering deposited SiGe films

Guo-Ping Ru,Xin-Ping Qu,Qiang Gu,Wen-Jie Qi,Bing-Zong Li
DOI: https://doi.org/10.1016/S0167-577X(02)00896-0
IF: 3
2002-01-01
Materials Letters
Abstract:Conventional dopant diffusion technique has been successfully employed to dope SiGe films deposited by ion-beam sputtering (IBS). The deposited a-SiGe films can be doped to both p and n types after boron and phosphorous diffusions at a temperature range of 850–1000 °C. The doping process is accompanied by crystallization of the a-SiGe film. Electrical properties of the doped SiGe films have been characterized by a four-point probe and Hall measurements. Hall mobilities as high as 13 and 31 cm2/V·s have been obtained in boron- and phosphorous-doped polycrystalline SiGe films, respectively.
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