Electrical Properties of Boron and Phosphorus Doped Polycrystalline Silicon Germanium Films

L Dong,RF Yue,W Yan,WT Huang,LT Liu
DOI: https://doi.org/10.1515/ijnsns.2002.3.3-4.677
2002-01-01
International Journal of Nonlinear Sciences and Numerical Simulation
Abstract:In this paper, the electrical properities of boron and phosphorus doped polycrystalline silicon germanium (poly-Si1-xGex) films with Ge mole fractions up to 0.51 are presented. Resistivity, Hall mobility and effective carrier concentration as a function of Ge mole fraction are discussed. Decreasing with the increase of Ge mole fraction, the resistivity of boron doped poly-Si1-xGex film is substantially lower than that of equivalently doped poly-Si film due both to higher levels of boron activation and higher hole mobility. The resistivity of phosphorus doped poly-Si1-xGex film is similar to that of equivalently doped poly-Si film and decreases slightly for Ge mole fraction below 0.4, but increases considerably for higher Ge content (x>0.4) because of a significant reduction in phosphorus activation. To achieve the same resistivity, lower annealing temperature, as well as lower implant dose is required for boron doped poly-Si1-xGex film. than for poly-Si film, which makes p-type poly-Si1-xGex film an alternative to p-type poly-Si film.
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