Dopant Activation in Poly-SI/sub1-x/Ge/subx/ at Low Temperature

Zhonghe Jin,Zhiguo Meng,Gururaj, B.A.,Yeung, M.
DOI: https://doi.org/10.1109/asid.1997.631400
1997-01-01
Abstract:Isothermal annealing of boron or phosphorus implanted polycrystalline Sil.,Ge, thin films, with x varying from 0.3 to 0.55 was reported in this paper. In low temperature (<=6OO0C) annealing, grain boundary segregation causes both the conductivity and the Hall mobility to decrease during extended annealing. The effective activation of phosphorus was less than 20% and decreases with increasing Ge content. Boron activation could reach above 70%. It was also found that Sil.,Ge, could be oxidized at 600°C in a conventional furnace even with pure N2 protection.
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