Effect of Phosphorus Content in Electroless Ni-P Substrate on the Surface Morphology of Gold Coating Obtained from Sulfite-thiosulfate Immersion Gold Plating Bath

刘海萍,李正,毕四富,于元春,滕祥国,屠振密
DOI: https://doi.org/10.15943/j.cnki.fdxb-jns.2012.02.012
2012-01-01
Abstract:An immersion gold coating was obtained on electroless Ni-P substrate in the sulfite-thiosulfate gold plating bath. The effects of phosphorus content in electroless Ni-P substrate and the time of immersion gold on the surface morphology of gold coating were investigated by atomic force microscopy surface analysis. The results show that a higher phosphorus content often lead to a better corrosion resistance of the Ni-P substrate and a better surface morphology of the gold coating with a smaller surface roughness. A smooth gold coating was obtained at 600 s, The longer of the dipping time results in a larger of the corrosion of Ni-P substrate and a larger of the surface roughness of the gold coating.
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