Electrode Effect on Resistive Switching of Ti-added Amorphous SiOx Films

Li-Ming Chen,Ting-Yi Lin,Chih-Chung Chang,Shih-Chin Chang,Tsung-Shune Chin
DOI: https://doi.org/10.1016/j.tsf.2010.04.111
IF: 2.1
2010-01-01
Thin Solid Films
Abstract:Ti-added amorphous SiOx films were sputter-deposited into stacks of Pt/SiOx/Pt and Cu/SiOx/Pt. Optimally prepared Pt/SiOx/Pt exhibits unipolar resistive switching over 102cycles, resistance ratio ∼103, yet wide voltage distribution (2∼7V for SET, 0.5∼1.5V for RESET). Cu/SiOx/Pt exhibit similar endurance, resistance ratio up to 107, and SET and RESET voltages reduced to 1.8∼4.2V and 0.5∼1V, respectively. Cu diffusion into SiOx at the virgin state may play a role in resistive switching of Cu/SiOx/Pt stack besides of filament conduction. Ti-added amorphous SiOx films incorporating Cu electrode shows potential for resistive memory.
What problem does this paper attempt to address?