Improvement of resistive switching characteristics in ZrO2 film by embedding a thin TiOx layer.

Yingtao Li,Shibing Long,Hangbing Lv,Qi Liu,Yan Wang,Sen Zhang,Wentai Lian,Ming Wang,Kangwei Zhang,Hongwei Xie,Su Liu,Ming Liu
DOI: https://doi.org/10.1088/0957-4484/22/25/254028
IF: 3.5
2011-01-01
Nanotechnology
Abstract:The stabilization of the resistive switching characteristics is important to resistive random access memory (RRAM) device development. In this paper, an alternative approach for improving resistive switching characteristics in ZrO2-based resistive memory devices has been investigated. Compared with the Cu/ZrO2/Pt structure device, by embedding a thin TiOx layer between the ZrO2 and the Cu top electrode, the Cu/TiOx-ZrO2/Pt structure device exhibits much better resistive switching characteristics. The improvement of the resistive switching characteristics in the Cu/TiOx-ZrO2/Pt structure device might be attributed to the modulation of the barrier height at the electrode/oxide interfaces.
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