Temperature and Electrode-Size Dependences of the Resistive Switching Characteristics of CuOx Thin Films

L. Tang,P. Zhou,Y. R. Chen,L. Y. Chen,H. B. Lv,T. A. Tang,Y. Y. Lin
DOI: https://doi.org/10.3938/jkps.53.2283
2008-01-01
Journal of the Korean Physical Society
Abstract:Due to the excellent characteristics and great affinity with the current CMOS process. resistive random access memory (BRAM) storage for next, generation non-volatile memory applications has been investigated widely. In this contribution, we will present advances in the resistance switching characteristics of CuOx thin films. The Al/CuoO(x)/Cu sandwiched structure fabricated by using the electro-chemical- planting and the oxygen plasma reactive ionic etching method presents reliable switching behaviors. The Al/CuOx/Cu device shows two resistance states, the high-resistance OFF state and the low-resistance ON state. Analyses of the current-voltage behaviors have been performed. and it is suggested that the switching occurs at, the interface between the CuOx film and the top electrode. The localized anode/oxide film interface effect, combined with the conductive filament formation and rupture phenomenological model, is used to eluicidate the switching process.
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