Origin of Hopping Conduction in Graphene-Oxide-Doped Silicon Oxide Resistance Random Access Memory Devices
Chang,Rui Zhang,Tsung-Ming Tsai,J. C. Lou,Jung-Hui Chen,Tai-Fa Young,Chen,Ya-Liang Yang,Yin-Chih Pan,Geng-Wei Chang,Tian-Jian Chu,Chih-Cheng Shih,Jian-Yu Chen,Chih-Hung Pan,Yu-Ting Su,Yong-En Syu,Ya-Hsiang Tai,Simon M. Sze
DOI: https://doi.org/10.1109/led.2013.2250899
IF: 4.8157
2013-01-01
IEEE Electron Device Letters
Abstract:In this letter, a double-active-layer (Zr:SiOx/C:SiOx) resistive switching memory device with a high ON/OFF resistance ratio and small working current (0.02 mA), is presented. Through the analysis of Raman and Fourier transform infrared spectroscopy spectra, we find that graphene oxide exists in the C:SiOx layer. It can be observed that Zr:SiOx/C: SiOx structure has superior switching performance and higher stability compared with the single-active-layer (Zr:SiOx) structure, which is attributed to the existence of graphene oxide flakes formed during the sputter process. I-V characteristics under a series of increasing temperature were analyzed to testify the carrier hopping distance variation, which is further verified by our graphene oxide redox reaction model.