A WO_X/AlON Dual-layer Resistive RAM with Low Power and Multi-level Storage Characteristic

TIAN Xiao-peng,LIN Yin-yin
DOI: https://doi.org/10.15943/j.cnki.fdxb-jns.2013.03.005
2013-01-01
Abstract:A low power and multilevel resistive switching memory device was proposed to solve the power consumption and high density storage problem.Compared with the AlON single-layer,the AlON/WOX bilayer structure displayed better performances,such as: lower reset current of 10μA,better endurance of 1000 cycles,lower operation voltage,and multilevle storage ability.An equivalent circuit model including a constant resistance in series with a diode was proposed for the WOX/AlON RRAM.During the set process,a large overshoot current flowed through the AlON single layer device,thus the compliance current failed to control the resistance.However,in the AlON/WOX bilayer device,there is a Schottky barrier formed in the WOX interface,which can effectively restrain the overshoot current.Therefore,the LRS can be controlled successfully,and multilevel storage was realized.
What problem does this paper attempt to address?