Excellent Resistive Switching Properties of Atomic Layer-Deposited Al2O3/HfO2/Al2O3 Trilayer Structures for Non-Volatile Memory Applications

Lai-Guo Wang,Qingyu Xu,Yan‐Qiang Cao,Zhengyi Cao,Guoyong Fang,Aidong Li,Di Wu
DOI: https://doi.org/10.1186/s11671-015-0846-y
2015-01-01
Nanoscale Research Letters
Abstract:We have demonstrated a flexible resistive random access memory unit with trilayer structure by atomic layer deposition (ALD). The device unit is composed of Al 2 O 3 /HfO 2 /Al 2 O 3 -based functional stacks on TiN-coated Si substrate. The cross-sectional HRTEM image and XPS depth profile of Al 2 O 3 /HfO 2 /Al 2 O 3 on TiN-coated Si confirm the existence of interfacial layers between trilayer structures of Al 2 O 3 /HfO 2 /Al 2 O 3 after 600°C post-annealing. The memory units of Pt/Al 2 O 3 /HfO 2 /Al 2 O 3 /TiN/Si exhibit a typical bipolar, reliable, and reproducible resistive switching behavior, such as stable resistance ratio (>10) of OFF/ON states, sharp distribution of set and reset voltages, better switching endurance up to 10 3 cycles, and longer data retention at 85°C over 10 years. The possible switching mechanism of trilayer structure of Al 2 O 3 /HfO 2 /Al 2 O 3 has been proposed. The trilayer structure device units of Al 2 O 3 /HfO 2 /Al 2 O 3 on TiN-coated Si prepared by ALD may be a potential candidate for oxide-based resistive random access memory.
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