Performance Improvement of CuOx RRAM for Non-volatile Applications

Yinyin Lin,Peng Zhou,M.H Chi,H B. Lv,S. Song,R. Huang,J. G. Wu,H M. Wu
DOI: https://doi.org/10.1149/1.3096463
2009-01-01
ECS Transactions
Abstract:We found CuOx thin film with gradual oxygen concentration (GOC) distribution enhances resistive switching characteristics for nonvolatile memory applications. Using Al/ GOC CuOx /Cu structure, not only no forming is needed, also the endurance of switching is greatly enhanced. The device with GOC CuOx demonstrates resistance on/off ratio greater than 100, and endurance of more than 12000 cycles. A ramped pulses series (RPS) operation method is also put forward, which can improve switching stability and cycling endurance remarkably. A method for minimizing the dispersion of Vreset by optimizing amplitude of pulse is proposed further. Dispersion of Vreset can be minimized by using optimized Vstart of RPS. And this phenomenon agrees well with the Joule heating model that the RESET process of memory switching is associated with rupturing of filaments by Joule heating.
What problem does this paper attempt to address?