Abstract:We demonstrate the fabrication of $\sim$1.08 $\mu$m deep microfluidic cavities with characteristic size as large as 7 mm $\times$ 11 mm or 11 mm diameter, using a silicon$-$glass anodic bonding technique that does not require posts to act as separators to define cavity height. Since the phase diagram of $^3$He is significantly altered under confinement, posts might act as pinning centers for phase boundaries. The previous generation of cavities relied on full wafer-bonding which is more prone to failure and requires dicing post-bonding, whereas the these cavities are made by bonding a pre-cut piece of Hoya SD-2 glass to a patterned piece of silicon in which the cavity is defined by etching. Anodic bonding was carried out at 425 $^{\circ}$C with 200 V, and we observe that pressurizing the cavity to failure ($>$ 30 bar pressure) results in glass breaking, rather than the glass-silicon bond separation. In this article, we discuss the detailed fabrication of the cavity, its edges, and details of the junction between the coin silver fill line and the silicon base of the cavity that enables a low internal-friction joint. This feature is important for mass coupling torsional oscillator experimental assays of the superfluid inertial contribution where a high quality factor ($Q$) improves frequency resolution. The surface preparation that yields well-characterized smooth surfaces to eliminate pinning sites, the use of transparent glass as a cover permitting optical access, low temperature capability and attachment of pressure-capable ports for fluid access may be features that are important in other applications.

Fabrication and characterization of 20 nm planar nanofluidic channels by glass-glass and glass-silicon bonding.

Simple and Cost-Effective Fabrication of Two-Dimensional Plastic Nanochannels from Silica Nanowire Templates

Fabrication of 1D nanofluidic channels on glass substrate by wet etching and room-temperature bonding

Fabrication And Characterization Of Sub-100/10nm Planar Nanofluidic Channels By Triple Thermal Oxidation And Silicon-Glass Anodic Bonding

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Fabrication of Fluidic Chips with 1-D Nanochannels on PMMA Substrates by Photoresist-Free UV-lithography and UV-assisted Low-Temperature Bonding

Micro Fabrication of Micro Fluidic Glass Chip Without Clean Room Condition

Fabrication of Micro/Nanofluidic Chip on Glass Substrate and Its Application for Electrokinetic Concentration of Proteins

Integrated fabrication of micro/nano-fluidic chip based on nano-imprint lithography and bonding

Design and fabrication of a nanofluidic channel by selective thermal oxidation and etching back of silicon dioxide made on a silicon substrate

Fabrication of micro fluidic cavities using Si-to-glass anodic bonding

Glass etching to bridge micro- and nanofluidics.

Fabrication of micro/nano fluidic channels by nanoimprint lithography and bonding using SU-8

Bonding of Glass Microfluidic Chips at Room Temperatures

A Simple Low-Temperature Glass Bonding Process with Surface Activation by Oxygen Plasma for Micro/Nanofluidic Devices

Fabrication of Optofluidic Systems Using Isotropic Wet Etched Masters in < 111 > Silicon Wafer

Electrostatic Bonding of A Silicon Master to A Glass Wafer for Plastic Microchannel Fabrication

Wafer-scale Fabrication of High-Aspect Ratio Nanochannels Based on Edge-Lithography Technique.

A simple approach to fabricate multi-layer glass microfluidic chips based on laser processing and thermocompression bonding