Real Time and Ex Situ Spectroscopic Ellipsometry Analysis Microcrystalline Silicon Thin Films Growth

Li Xin-Li,Gu Jin-Hua,Gao Hai-Bo,Chen Yong-Sheng,Gao Xiao-Yong,Yang Shi-E,Lu Jing-Xiao,Li Rui,Jiao Yue-Chao
DOI: https://doi.org/10.7498/aps.61.036802
IF: 0.906
2012-01-01
Acta Physica Sinica
Abstract:Microcrystalline silicon thin films with and without a seed layer are deposited using very high frequency plasma enhanced chemical vapor deposition method at a high growth rate. The influence of the seed-layer method on the film growth and structure are investigated using spectroscopic ellipsometry (SE), Raman spectrum and X-ray diffraction. The results show that the seed-layer can not only increase the growth rate, but also promote crystalline nucleation at the initial growth stage. The deposition processes are monitored by real time spectroscopic ellipsometry (RTSE). The film is also measured by ex situ SE in the air. The differences between the RTSE and ex situ SE are studied in testsing the microcrystalline silicon thin films. Results show that for the thin films the total thickness obtained by RTSE is smaller than that by ex situ SE, while for the thick films the measured total thicknesses by the two methods are almost the same. However, the surface roughness thickness detected by RTSE is larger than that by ex situ SE. The reason for this is due to the oxidation of the thin film exposed to the air which can smooth the film surface.
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