Investigation of Gate Oxide Traps Effect on NAND Flash Memory by TCAD Simulation*
He-Kun Zhang,Xuan Tian,Jun-Peng He,Zhe Song,Qian-Qian Yu,Liang Li,Ming Li,Lian-Cheng Zhao,Li-Ming Gao
DOI: https://doi.org/10.1088/1674-1056/ab695f
2020-01-01
Abstract:The effects of gate oxide traps on gate leakage current and device performance of metal–oxide–nitride–oxide–silicon (MONOS)-structured NAND flash memory are investigated through Sentaurus TCAD. The trap-assisted tunneling (TAT) model is implemented to simulate the leakage current of MONOS-structured memory cell. In this study, trap position, trap density, and trap energy are systematically analyzed for ascertaining their influences on gate leakage current, program/erase speed, and data retention properties. The results show that the traps in blocking layer significantly enhance the gate leakage current and also facilitates the cell program/erase. Trap density ∼ 1018 cm−3 and trap energy ∼ 1 eV in blocking layer can considerably improve cell program/erase speed without deteriorating data retention. The result conduces to understanding the role of gate oxide traps in cell degradation of MONOS-structured NAND flash memory.