Electrical Properties of PolySiGe Grown by Metal-Induced Growth

Wu Guibin,Ye Zhizhen,Zhao Xing,Liu Guojun
DOI: https://doi.org/10.3969/j.issn.1672-7126.2006.03.018
2006-01-01
Abstract:A novel technique has been developed to fabricate Al/polySiGe/Ni silicides Schottky diode by metal-induced growth and by ultra high vacuum chemical vapor deposition(UHV/CVD) on n-type Si(100) substrate.In the technique,firstly,Ni layer of 30 nm thick is vacuum evaporated on thermally oxidized n-type Si(100) with an amorphous SiO_2 layer of 300 nm,then,Ni film reacts with a gaseous mixture of SiH_4,GeH_4,H_2 and phosphine at a substrate temperature of 530 ℃ to form nickel silicides until Ni layer exhausts and finally,Al/poly SiGe/Ni silicides Schottky diode is fabricated by depositing aluminum layer as electrode on amorphous SiGe films,grown by CVD on top of Ni silicides.I-V characteristics of the diode show that the rectification ratio reaches 8 000 at bias voltages of ±1 V,and the leakage current is lower that 10~(-7) A at a reverse bias of-2 V.
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