Abstract:This paper presents a new 3D heterogeneous integration scheme for inertial Micro-system, where a TSV interposer with a cavity is used to separate two aligned TSV interposers that are mounted with inertial MEMS (Micro Electro-Mechanical System) devices, ASIC (Application Specific Integrated Circuit) chips, and passive components receptively. A finite element simulation method that uses equivalent elements and sub-model methods is developed to do design for reliability in Thermal Cycling Test (TCT). Comparing with the normal simulation method, an agreement is obtained in the stress distribution in the MEMS chips, TSVs and micro bumps. In the meantime, the simplified simulation method provides a competitive accuracy, the difference is 0.88% in the maximum deformation of the whole model between the two methods, the difference is 0.41% in the maximum deformation of the TSV and 0.65% in the micro bump at the most dangerous position. Base on this simplified simulation method, a 3D heterogeneous inertial micro-system is analyzed and optimized. The design of ladder TSV with the usage of underfill and gold balls is selected. The simulation results also showed that RDL (Redistribution Layer) can make significant influence on the stress distribution in the systems. If considering RDL, the maximum stress inside the micro bump at the most dangerous location increases by 62.79% while the max stress in TSV decreases by 14.03%, which means that stress optimization should also be carried out after designing the RDL layout.

The Simulation Research of DRIE Process

Improvement of Drie Simulation Method for Process Development Application

Research on deep RIE-based through-si-via micromachining for 3-D system-in-package integration

Development of TSV simulator: FASTsv.

Fabrication of 3D Packaging TSV using DRIE

Three-Dimensional Simulation of DRIE Process Based on the Narrow Band Level Set and Monte Carlo Method

Design and analysis of an I-shaped TSV structure for 3D SiP

3D Simulation of Profile Evolution in Silicon DRIE

Parametric Study of DRIE Process for Enhancing the Profile-Preserving Property of Square Through Silicon Via

Electrical-Thermal Co-Simulation For Through Silicon Via And Active Tier In 3-D Ic

System-Level Analysis of 3D ICs with Thermal TSVs

Testing 3D chips containing through-silicon vias

Optimization of innovative approaches to the shortening of filling times in 3D integrated through-silicon vias (TSVs)

Microfabrication of Through Silicon Vias (TSV) for 3D SiP

Fabrication and Filling Quality Optimization of the High Density and Small Size Through Silicon Via Array for Three-Dimensional Packaging

Survey on Testing Methods for 3D IC

Electrical Simulation and Analysis of Si Interposer for 3d Ic Integration

Simulation of TSV Protrusion in 3DIC Integration by Directly Loading on Coarse-Grained Phase-Field Crystal Model

A Full Chip Scale Numerical Simulation Method for Thermal Management of 3D IC

Simulation and Optimization of 3D Heterogeneous Integration of Inertial Micro-System

A 3D Integration Testing Vehicle with TSV Interconnects