Demonstration of 40-Nm Channel Length Top-Gate P-Mosfet of WS2 Channel Directly Grown on SiO$_{{x}}$ /si Substrates Using Area-Selective CVD Technology
Yun-Yan Chung,Kuan-Cheng Lu,Chao-Ching Cheng,Ming-Yang Li,Chao-Ting Lin,Chi-Feng Li,Jyun-Hong Chen,Tung-Yen Lai,Kai-Shin Li,Jia-Min Shieh,Sheng-Kai Su,Hung-Li Chiang,Tzu-Chiang Chen,Lain-Jong Li,H-S Philip Wong,Wen-Bin Jian,Chao-Hsin Chien
DOI: https://doi.org/10.1109/ted.2019.2946101
2019-01-01
Abstract:For high-volume manufacturing of 2-D transistors, area-selective chemical reaction deposition (CVD) growth is able to provide good-quality 2-D layers and may be more effective than exfoliation from bulk crystals or wet/dry transfer of large-area as-grown 2-D layers. We have successfully grown continuous and uniform WS2 film comprising around seven layers by area-selective CVD approach using patterned tungsten source/drain metals as the seeds. The growth mechanism is inferred and supported by the transmission electron microscope (TEM) images, as well. The first top-gate MOSFETs of CVD-WS2 channels on SiOx/Si substrates are demonstrated to have good short channel electrical characteristics: ON-/OFF-ratio of 10(6), a subthreshold swing of 97 mV/decade, and nearly zero drain-induced barrier lowering (DIBL).