Demonstration of Schottky Barrier NMOS Transistors with Erbium Silicided Source/Drain and Silicon Nanowire Channel

Eu Jin Tan,Kin-Leong Pey,Navab Singh,Guo-Qiang Lo,Dong Zhi Chi,Yoke King Chin,Keat Mun Hoe,Guangda Cui,Pooi See Lee
DOI: https://doi.org/10.1109/led.2008.2004508
IF: 4.8157
2008-01-01
IEEE Electron Device Letters
Abstract:We have fabricated silicon nanowire N-MOSFETs using erbium disilicide (ErSi2-x) in a Schottky source/drain back-gated architecture. Although the subthreshold swing (~180 mV/dec) and drain-induced barrier lowering (~500 mV/V) are high due thick BOX as gate oxide, the fabricated Schottky transistors show acceptable drive current ~900 muA/mum and high Ion/Ioff ratio (~105). This is attributed to the improved carrier injection as a result of low Schottky barrier height (Phib) of ErSi2-x/n - Si(~0.3 eV) and the nanometer-sized (~8 nm) Schottky junction. The carrier transport is found to be dominated by the metal-semiconductor interface instead of the channel body speculated from the channel length independent behavior of the devices. Furthermore, the transistors exhibit ambipolar characteristics, which are modeled using thermionic/thermionic-field emission for positive and thermionic-field emission for negative gate biases.
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