Electrical Characterization of Nisi/Si Interfaces Formed by A Single and A Two-Step Rapid Thermal Silicidation

YL Jiang,GP Ru,W Huang,XP Qu,BZ Li,A Agarwal,G Cai,J Poate,C Detavernier,RL Van Meirhaeghe
DOI: https://doi.org/10.1088/0268-1242/20/8/011
IF: 2.048
2005-01-01
Semiconductor Science and Technology
Abstract:This paper investigates the electrical characteristics of NiSi Schottky barrier diodes (SBD). A single-step rapid thermal process (RTP) and a two-step RTP were employed to form the SBDs. The diode structures were designed so as to minimize edge leakage. The two-step silicidation process resulted in a significant reduction of the reverse leakage current density, suggesting an improvement of the interface characteristics. Temperature-dependent current-voltage measurements were used to analyse the interface characteristics. The two-step RTP process reduces the density of non-ideal micro-contacts with low barrier height, which are responsible for the reverse leakage current.
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