Effect of Top Al2O3 Interlayer Thickness on Memory Window and Reliability of FeFETs With TiN/Al2O3/Hf0.5Zr0.5O2/SiOx/Si (MIFIS) Gate Structure
Tao Hu,Xinpei Jia,Runhao Han,Jia Yang,Mingkai Bai,Saifei Dai,Zeqi Chen,Yajing Ding,Shuai Yang,Kai Han,Yanrong Wang,Jing Zhang,Yuanyuan Zhao,Xiaoyu Ke,Xiaoqing Sun,Junshuai Chai,Hao Xu,Xiaolei Wang,Wenwu Wang,Tianchun Ye
2024-11-13
Abstract:We investigate the effect of top Al2O3 interlayer thickness on the memory window (MW) of Si channel ferroelectric field-effect transistors (Si-FeFETs) with TiN/Al2O3/Hf0.5Zr0.5O2/SiOx/Si (MIFIS) gate structure. We find that the MW first increases and then remains almost constant with the increasing thickness of the top Al2O3. The phenomenon is attributed to the lower electric field of the ferroelectric Hf0.5Zr0.5O2 in the MIFIS structure with a thicker top Al2O3 after a program operation. The lower electric field makes the charges trapped at the top Al2O3/Hf0.5Zr0.5O2 interface, which are injected from the metal gate, cannot be retained. Furthermore, we study the effect of the top Al2O3 interlayer thickness on the reliability (endurance characteristics and retention characteristics). We find that the MIFIS structure with a thicker top Al2O3 interlayer has poorer retention and endurance characteristics. Our work is helpful in deeply understanding the effect of top interlayer thickness on the MW and reliability of Si-FeFETs with MIFIS gate stacks.
Materials Science,Applied Physics