Fabrication And Properties Of Pt/Bi3.15nd0.85ti3o12/Hfo2/Si Structure For Ferroelectric Dram (Fedram) Fet

Dan Xie,Yongyuan Zang,Yafeng Luo,Tianling Ren,Litian Liu
DOI: https://doi.org/10.1109/LED.2009.2016119
IF: 4.8157
2009-01-01
IEEE Electron Device Letters
Abstract:Metal-ferroelectric-insulator-semiconductor (MFIS) capacitors with 400-nm-thick Bi3.15Nd0.85Ti3O12 (BNdT) ferroelectric film and 4-nm-thick hafnium oxide (HfO2) layer on silicon substrate have been fabricated and characterized. It is demonstrated that the Pt/Bi3.15Nd0.85Ti3O12/HfO2/Si structure exhibits a large memory window of around 1.12 V at an operation voltage of 3.5 V. Moreover, the MFIS memory structure suffers only 10% degradation in the memory window after 10(10) switching cycles. The retention time is 100 s, which is enough for ferroelectric DRAM field-effect-transistor application. The excellent performance is attributed to the formation of well-crystallized BNdT perovskite thin film on top of the HfO2 buffer layer, which serves as a good seed layer for BNdT crystallization, making the proposed Pt/Bi3.15Nd0.85Ti3O12/HfO2/Si suitable for high-performance ferroelectric memories.
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