ATOMIC LAYER DEPOSITION HfO2 FILM USED AS BUFFER LAYER OF THE Pt/(Bi0.95Nd0.05)(Fe0.95Mn0.05)O3/HfO2/Si CAPACITORS FOR FeFET APPLICATION

Dan Xie,Tingting Feng,Yafeng Luo,Xueguang Han,Tianling Ren,Markus Bosund,Shuo Li,Veli-Matti Airaksinen,Harri Lipsanen,Seppo Honkanen
DOI: https://doi.org/10.1142/s2010135x11000458
2011-01-01
Journal of Advanced Dielectrics
Abstract:Neodymium and manganese-doped BiFeO 3 — (Bi 0.95 Nd 0.05 )(Fe 0.95 Mn 0.05 )O 3 (BNFMO) ferroelectric film and HfO 2 layer with different thickness were fabricated using metal-organic decomposition and atomic layer deposition (ALD) method, respectively. Metal-ferroelectric-insulator-semiconductor (MFIS) capacitors with 200 nm thick BNFMO and 5 nm thick HfO 2 layer on silicon substrate have been prepared and characterized. It is found that there is no distinct interdiffusion and reaction occurring at the interface between BNFMO/HfO 2 and HfO 2 /Si . The capacitance–voltage (C–V) and leakage current properties of Pt/HfO 2 /Si capacitors with different HfO 2 thickness were studied. The MFIS structure showed clockwise C–V hysteresis loops due to the ferroelectric polarization of BNFMO . The maximum memory window is 5 V. The leakage current of the Pt/BNFMO/HfO 2 /Si capacitor was about 2.1 × 10 -6 A/cm 2 at an applied voltage of 4 V.
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