Electric Properties of Pt/PbZr 0.53 Ti 0.47 O 3 /laalo 3 /si Structure

YP Wang,XB Lu,HQ Ling,ZG Liu
DOI: https://doi.org/10.1080/10584580212366
2002-01-01
Integrated Ferroelectrics
Abstract:Pb(Zr,Ti)O-3 (PZT) is a well known ferroelectric material for nonvolatile memory applications. However, interfacial diffusion and reaction are the main issues when PZT films were deposited directly on silicon. One way to overcome this obstacle is to deposit a barrier layer between PZT and Si. In this work, Pt/PbZr0.53Ti0.47O3/LaAlO3/Si structure has been fabricated to study the electric properties. PbZr0.53Ti0.47O3 films with 300 nm thickness and LaAlO3 buffer layers with 30 nm thickness were prepared by pulsed laser deposition technique on n-type Si (100) substrates at 650 degreesC and 450 degreesC, respectively. X-ray diffraction shows that polycrystalline PbZr0.53Ti0.47O3 film was formed on amorphous LaAlO3 buffer layer. The Auger electron spectrometer demonstrates that LaAlO3 buffer layer effectively prevent Si and Ti, Ph interdiffusion between PZT and Si substrates. For the Pt/PbZr0.53Ti0.47O3/LaAlO3/Si Structure, the current density-voltage measurement showed a typical leakage current density of about 10(-7) A/cm(2) at 8 V applied voltage. Furthermore, it has been measured that the Pt/PbZr0.53Ti0.47O3/LaAlO3/Si heterostructures exhibit ferroelectric switching properties, showing a memory window as large as 2 V under a ramp rate of 200 mV/s at I MHz.
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