The effect of hydrogen passivation on electrical characteristics of double-polysilicon self-aligned bipolar transistors

M Sandén,T.E Karlin,P Ma,J.V Grahn,S.-L Zhang,M Östling
DOI: https://doi.org/10.1016/S0038-1101(98)00288-3
IF: 1.916
1999-01-01
Solid-State Electronics
Abstract:The influence of hydrogen passivation using forming gas annealing (FGA), on the electrical performance of double-polysilicon self-aligned bipolar junction transistors was investigated. While the collector current remained essentially unaffected after FGA, the base current decreased substantially. As a result, the peak DC current gain increased by a factor of three. Identification of the Various base current components showed that the SiO2/monosilicon interface area along the perimeter of the emitter window, were effectively passivated after FGA, both in the quasi-neutral base and in the space charge region. The FGA treatment was also found to lead to an increase in the peak cut-off frequency by up to 40%. This is explained by a decrease in emitter-base junction capacitance, which was verified experimentally. (C) 1999 Elsevier Science Ltd. All rights reserved.
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