The Influence on Electrical Performance of Double-Polysilicon Bipolar Transistors by Forming Gas Annealing

M Sanden,TE Karlin,P Ma,JV Grahn,SL Zhang,M Ostling
DOI: https://doi.org/10.1238/physica.topical.079a00243
1999-01-01
Physica Scripta
Abstract:The influence on the electrical performance of double-polysilicon self-aligned bipolar junction transistors by hydrogen passivation using forming gas annealing (FGA) was investigated. While the collector current remained essentially unaffected, the base current decreased substantially after the FGA. As a result, the peak DC current gain increased approximately by a factor of three. A simple model was employed to extract the base saturation current components. It was found that the base recombination currents mainly were related to the defects (i.e. recombination centers) located at the SiO2/monosilicon interface beneath the L-shaped emitter window spacers. The FGA also caused the peak cut-off frequency fT to increase by 40%. The fT enhancement is probably related to passivation of defects in the emitter/base space-charge region at the SiO2/monosilicon interface beneath the sidewall spacers.
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