Influence of Phosphorus Doping in the Active Layer with Deposition Time and Gas Flow Rate in a-Si:H Thin Film Transistor
Byung-Ju Kim,Sang-Kwon Lee,Ae-Ri Kim,Sie-Young Choi
DOI: https://doi.org/10.1080/15421406.2011.600590
IF: 0.7
2011-10-18
Molecular Crystals and Liquid Crystals
Abstract:Influence of phosphorus doping in the a-Si:H layer with various deposition time and phosphine gas flow rate in hydrogenated amorphous silicon thin film transistor (a-Si:H TFT) has been investigated. The a-SiN:H layer, the phosphorus doped a-Si:H layer and the n+ a-Si:H layer were deposited by plasma enhanced chemical vapor deposition (PECVD) using SiH4, PH3, Ar, H2 and NH3 gases. Proper phosphorus doping in the a-Si:H layer affected the channel of the a-Si:H TFT and improved the characteristics. Also, the field effect mobility was increased from 0.22 to 0.61 cm2/V·s. The characteristics of phosphorus doping in the a-Si:H TFT were investigated and compared with the conventional a-Si:H TFT.
chemistry, multidisciplinary,materials science,crystallography