Abstract:In this paper, a through-glass-via (TGV) interposer for 2.5D radio frequency (RF) integration is presented. A coplanar waveguide (CPW) transmission line with grounded TGVs on one side interconnects with the mounted RF devices, and an electrical ground plane on the other side. Tapered TGVs are fabricated using a combined method of sandblasting and thinning/polishing process to achieve precise control of the profile of the vias and improve uniformity. The TGVs are metalized by conformal copper (Cu) electroplating to form a vertical interconnection between the upper and lower metal layers, which can maintain RF performance and avoid thermal stress issues. The CPW transmission lines with electrically grounded TGVs and test structures are designed, fabricated and tested to evaluate the TGV's RF performance and suitability for 2.5D RF integration. The RF measurements show that the insertion loss is about 0.13 dB mm(-1) @ 10 GHz for the CPW line with grounded TGV which is less than 0.1 dB @ 10 GHz for a single TGV. We analyzed S parameter for the tests and simulations when taking into account various factors in the manufacturing process, such as the surface roughness and metal resistivity. The results provide a research direction for the optimization of the parameters in the follow-up study. In addition, a 2.5D RF receiver module based on the proposed TGV interposer in the L-band is assembled and validated. The gain value of the TGV interposer integrated RF module is about 14.4 dB, which is close to the theoretical value.

Extracting and Analyzing the S-Parameters of Vertical Interconnection Structures in 3D Glass Packaging

Exploration and Analysis of Through-Glass Vias for High-Speed, Low-Loss Vertical Interconnects in Glass-Based 3-D Integrated Circuits

Wideband Analysis and Prolongation of Surrounding TGVs Shielding Structure in 3-D ICs

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

Parameter Characterization Of Silicon-Based Patterned Shield And Patterned Ground Shield Coplanar Waveguides

General Analytical Method for Investigating Parasitic Characteristics of Through Glass Vias (TGVs) in 3-D Integration

Methods and designs for improving the signal integrity for 3D electrical interconnects in high performance IC packaging

Design of Compact and Low-Emi Waveguide Structures Based on Through Glass Vias

Transmission Characteristics Of A Coaxial Through-Silicon Via (C-Tsv) Interconnect

Design and Modeling of Non-Uniform Through-Glass Vias and Its Optimization Methods

Capacitive coupling analysis of TSV array in 3D packaging

Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix

Design, Fabrication, and Radio Frequency Property Evaluation of a Through-Glass-via Interposer for 2.5D Radio Frequency Integration

Analysis and Optimization of Sidewall Roughness on Microwave Performance of Through-Glass Vias in 3-D Integrated Circuits

Performance and reliability study of TGV interposer in 3D integration

Accurate Field-Circuit Hybrid Modeling of High Density Through Glass Via Arrays by Using Perfect Magnetic Conductors and Cylindrical Mode Expansion

Layout Optimization of Integrated Inductors and Capacitors Using TGV Technology

Parasitic RLGC Properties of High-density Through-Glass Via

Low-loss Through Silicon Vias (tsvs) and Transmission Lines for 3D Optoelectronic Integration

3D Modeling and Finite-Element Full-Wave Simulation of TSV for Stack Up SIP Integration Applications

Investigating the Tapered Profiles on the Parasitic Inductance of Through-Silicon Vias