Abstract:Silica nanoparticles are widely utilized abrasives in chemical mechanical polishing (CMP), and the modification of abrasives and the incorporation of chemical additives represent primary strategies for enhancing CMP performance. In this study, we achieved a modification of the electrical properties of the colloidal silica surface by forming a coating film through the "grafting" of 3-aminopropyltriethoxysilane (APTES) onto the colloidal silica surface. This modification resulted in an augmented mechanical interaction between the abrasive and the wafer during the CMP process, leading to an enhanced material removal rate (MRR) of SiO 2 . However, the post-CMP surface exhibited a relatively higher occurrence of surface defects. Subsequently, cetyltrimethylammonium bromide (CTAB) was added as an auxiliary additive, which promoted the formation of a "special electrostatic self-assembly structure" on the surface of the abrasive, further elevating the SiO 2 MRR. Moreover, CTAB demonstrated the capability to adsorb onto the wafer surface, creating a protective effect that resulted in reduced surface roughness and a decrease in surface defects following CMP. Furthermore, comprehensive characterization of the modified abrasive was conducted using techniques such as transmission electron microscopy (TEM) and scanning electron microscopy (SEM). The mechanisms underlying the improvement in CMP performance were systematically analyzed through experimental phenomena and X-ray photoelectron spectroscopy (XPS), and revealing that the introduction of CTAB indirectly facilitated the adsorption of APTES onto the surface of the colloidal silica. Our study provides a method for the advanced process of SiO 2 CMP with stringent metal ion requirements.

Investigation on morphology and chemistry of the Beilby layer on polished fused silica

Investigation of the Chemical Residuals on the Fused Silica During Chemical Mechanical Polishing

Effect of colloidal silica particles on subsurface damage of fused silica optics during CMP process

Combination of scanning ion beam etching and dynamic chemical etching for improving laser damage resistance of fused silica optics

Application of surface analysis in study on removal mechanism and abrasive selection during fused silica chemical mechanical polishing

Layer by layer exposure of subsurface defects and laser-induced damage mechanism of fused silica

Novel green chemical mechanical polishing of fused silica through designing synergistic CeO 2 /h-BN abrasives with lubricity

Trivalent lanthanum and ytterbium doped meso-silica/ceria abrasive systems toward chemical mechanical polishing (CMP) and ultraviolet irradiation-assisted photochemical mechanical polishing (PCMP)

Investigation of the Multimechanism Laser Cleaning Dynamics for Rough Fused Silica Surfaces with Organic Contaminants: A Computational Simulation and Atomic Analysis.

RE (la, Nd and Yb) Doped CeO2 Abrasive Particles for Chemical Mechanical Polishing of Dielectric Materials: Experimental and Computational Analysis

Ab Initio Molecular Dynamics Simulation of the Effect of Impurities on Laser-Induced Damage of Fused Silica

A special electrostatic self-assembly structure of colloidal silica: Improving Chemical Mechanical Polishing performance

Effect of Polishing-Induced Subsurface Impurity Defects on Laser Damage Resistance of Fused Silica Optics and Their Removal with Hf Acid Etching

XPS, UV–vis Spectroscopy and AFM Studies on Removal Mechanisms of Si-face SiC Wafer Chemical Mechanical Polishing (CMP)

Removal mechanism on 4H–SiC single crystal by picosecond laser ablation-assisted chemical mechanical polishing (CMP)

Investigation of Subsurface Damage Density and Morphology Impact on the Laser-Induced Damage Threshold of Fused Silica

Study on the Absorption Characteristics and Laser Damage Properties of Fused Silica Optics under Flexible Polishing and Shallow DCE Process

The Deterioration Characteristics and Mechanism of Polishing Pads in Chemical Mechanical Polishing of Fused Silica

Analysis and Experimental Investigation of Laser Induced Damage of Optics

Effects of fused silica surface roughness on the interfacial adsorption mechanism of contaminant

Synthesis, Characterization of Ceo2@Zif-8 Composite Abrasives and Their Chemical Mechanical Polishing Behavior on Glass Substrate